Firstly, one of the difficulties in designing and manufacturing high-frequency high-speed boards is ensuring signal integrity.

　　Due to the transmission characteristics of high-frequency signals, the requirements for signal integrity are very high. Once the signal experiences attenuation, interference, or distortion, it will lead to a decrease in system performance or even malfunction. The key to solving the problem of signal integrity is to choose materials, wiring, and grounding methods reasonably, and conduct strict signal integrity simulation and testing.

　　Secondly, the design and production of high-frequency high-speed boards also face challenges in terms of high-frequency characteristics and electromagnetic compatibility.

　　In the transmission of high-frequency and high-speed signals, electromagnetic wave radiation and interference will become a serious problem. In order to improve electromagnetic compatibility, it is necessary to design and layout devices, pins, and ground wires reasonably, and simulate and test electromagnetic compatibility to ensure compliance with relevant standards and requirements.

　　In addition, the design and production of high-frequency high-speed boards also need to overcome issues such as inter layer interconnection, crosstalk, and signal layer cutting.

　　In high-frequency high-speed boards, interlayer interconnections and crosstalk can have a significant impact on the signal. Therefore, it is necessary to adopt appropriate interlayer processing techniques, such as using buried capacitors and introducing layers resistant to electromagnetic interference, in order to improve the stability and reliability of the signal.