PCB circuit board reflow soldering is one of the common welding methods in the electronic assembly process. It firmly fixes electronic components on the PCB board by applying appropriate heat and melted solder paste to pre arranged welding points. However, some common problems may also arise during the reflow soldering manufacturing process. Introduce these issues and corresponding solutions.

　　1、 Tin splashing on the board surface

　　Problem description: Tin splashing on the board refers to the excessive amount of solder around the welding point during reflow soldering. This may cause damage to components near the welding point, and even cause short circuits or welding failures.

　　Solution: There are several methods to solve the problem of tin splashing on the board surface. Firstly, check whether the size and position of the welding points are appropriate to avoid excessive soldering caused by design defects. Secondly, adjust the temperature and speed in the reflow soldering furnace to ensure that the solder can be evenly distributed on the welding points. Finally, use appropriate welding through-holes to accurately transfer heat and avoid excessive tin splashing.

　　2、 Poor welding

　　Problem description: Poor welding refers to the failure of the welding point to achieve the desired welding effect during reflow soldering. This may manifest as solder gaps, solder pads not covering solder, and other phenomena, affecting the quality and performance of PCB boards.

　　Solution: To solve the problem of poor welding, first ensure that the temperature and time settings of the welding equipment are correct to ensure that the solder can fully melt and cover the solder pad. Secondly, check the quality of the welding materials and whether the soldering tin meets the standard requirements. Finally, optimize the welding process parameters, such as heating curve, reflux zone, etc., to achieve better welding results.

　　3、 Component offset

　　Problem description: Component offset refers to the failure of electronic components to be accurately positioned on the solder pad during reflow soldering, resulting in soldering failure or performance degradation.

　　Solution: To solve the problem of component deviation, first check whether the component positioning device in the welding process is working properly to ensure that the component can be accurately fixed on the solder pad. Secondly, ensure that the temperature and speed settings in the welding process are appropriate to avoid component movement caused by thermal expansion and contraction. Finally, carefully calibrate the dimensions and positions of the components to improve welding accuracy and stability.