PCB circuit board reflow soldering is one of the common welding  methods in the electronic assembly process. It firmly fixes electronic  components on the PCB board by applying appropriate heat and melted solder paste  to pre arranged welding points. However, some common problems may also arise  during the reflow soldering manufacturing process. The manufacturer of  intelligent circuit boards will introduce these issues and corresponding  solutions.

1、 Tin splashing on  the board surface

Problem description: Tin splashing on the board refers to the  excessive amount of solder around the welding point during reflow soldering.  This may cause damage to components near the welding point, and even cause short  circuits or welding failures.

Solution: There are several methods to solve the problem of tin  splashing on the board surface. Firstly, check whether the size and position of  the welding points are appropriate to avoid excessive soldering caused by design  defects. Secondly, adjust the temperature and speed in the reflow soldering  furnace to ensure that the solder can be evenly distributed on the welding  points. Finally, use appropriate welding through-holes to accurately transfer  heat and avoid excessive tin splashing.

2、 Poor  welding

Problem description: Poor welding refers to the failure of the  welding point to achieve the desired welding effect during reflow soldering.  This may manifest as solder gaps, solder pads not covering solder, and other  phenomena, affecting the quality and performance of PCB  boards.

Solution: To solve the problem of poor welding, first ensure that  the temperature and time settings of the welding equipment are correct to ensure  that the solder can fully melt and cover the solder pad. Secondly, check the  quality of the welding materials and whether the soldering tin meets the  standard requirements. Finally, optimize the welding process parameters, such as  heating curve, reflux zone, etc., to achieve better welding  results.

3、 Component  offset

Problem description: Component offset refers to the failure of  electronic components to be accurately positioned on the solder pad during  reflow soldering, resulting in soldering failure or performance  degradation.

Solution: To solve the problem of component deviation, first check  whether the component positioning device in the welding process is working  properly to ensure that the component can be accurately fixed on the solder pad.  Secondly, ensure that the temperature and speed settings in the welding process  are appropriate to avoid component movement caused by thermal expansion and  contraction. Finally, carefully calibrate the dimensions and positions of the  components to improve welding accuracy and stability.