1、 V-shaped cutting and splitting process

　　The V-shaped cutting and splitting process uses a V-shaped cutting tool to cut V-shaped grooves on both sides of the circuit board, and then break the circuit board to separate it. This process is suitable for most general board splitting needs, with simple operation and low cost. However, its disadvantage is that it is prone to cutting burrs and uneven board edges, making it suitable for circuit boards with no connectors or components on the edges.

　　2、 Machine milling and cutting process

　　The machine milling and cutting process involves using a CNC machine tool for cutting and performing milling operations according to a predetermined cutting path. It can more accurately control the position and size of the split board, suitable for complex split board requirements. The edges after milling are smooth and flat, and can be directly used for welding. However, the machine milling and cutting process has a high cost and is not suitable for high-demand mass production.

　　3、 Drilling and splitting process

　　The drilling and splitting process involves pre drilling to form a dividing line, which is then divided by a wire cutting machine, manual wire cutting machine, or hot plate wire cutting machine. This process is suitable for circuit boards that require drilling in the sub board area. Its advantages are low cost and suitable for small batch production, but the edge of the drilled board is not as flat as milling and cutting.

　　4、 Laser cutting and splitting process

　　The laser cutting and splitting process uses a laser beam for cutting, which can achieve high-precision splitting. It is suitable for board splitting requirements that require very high precision, especially for circuit boards with special materials or complex circuits. The advantage of laser cutting is that it does not generate mechanical stress, and the cutting speed is fast and accurate. However, laser cutting equipment is expensive and requires professional operation.