A: Component installation offset mainly refers to the position deviation in X-Y after the component is installed on the PCB. The reasons for this are as follows:

　　(1) Reason for PCB board

　　a: The curvature of the PCB board exceeds the allowable range of the device. The maximum upwarping is 1.2mm, and the maximum downwarping is 0.5mm.

　　b: The height of the support pins is inconsistent, resulting in uneven support of the printed board.

　　c: Poor flatness of workbench support platform

　　d: Circuit board wiring has low accuracy and poor consistency, especially with significant differences between batches.

　　(2) The suction pressure of the mounting nozzle is too low, and it should be above 400mmHG when taking out and mounting.

　　(3) Abnormal blowing pressure during installation.

　　(4) Abnormal or deviation in the amount of adhesive or solder paste applied. This leads to displacement during component installation or welding, resulting in deviation from the original position during high-speed movement of the workbench after component installation. The coating position is inaccurate, and corresponding displacement occurs due to its tension effect.

　　(5) The program data device is incorrect.

　　(6) Poor positioning of the substrate.

　　(7) The movement of the mounting nozzle when it rises is not smooth and relatively slow.

　　(8) The coupling between the power and transmission components of the X-Y workbench is loose.

　　(9) Poor installation of the suction nozzle for the mounting head.

　　(10) The blowing timing does not match the descending timing of the mounting head.

　　(11) The initial data settings of the suction nozzle center data and the camera of the optical recognition system are poor.