1. PBGA (Plastic BGA) substrate: Generally a multi-layer board composed of 2-4 layers of organic materials. In the Intel series of CPUs, Pentium II, III, and IV processors all adopt this packaging form. In the past two years, another form has emerged: directly binding ICs to boards, which are much cheaper than regular prices and are generally used in fields such as games that do not have strict quality requirements.

　　2. CBGA (CeramicBGA) substrate: refers to a ceramic substrate, and the electrical connection between chips and substrates is usually installed using FlipChip (FC). In the Intel series of CPUs, Pentium I, II, and Pentium Pro processors have all adopted this packaging form.

　　3. FCBGA (FilpChipBGA) substrate: Hard multilayer substrate.

　　4. TBGA (TapeBGA) substrate: The substrate is a ribbon soft 1-2 layer PCB circuit board.

　　5. CDPBGA (Carity Down PBGA) substrate: Refers to the chip area (also known as the cavity area) with a square depression in the packaging center.