The memory packaged with BGA technology can increase the memory capacity by two to three times without changing its volume. Compared with TSOP, BGA has smaller volume, better heat dissipation performance, and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch. Memory products using BGA packaging technology have a volume of only one-third that of TSOP packaging at the same capacity; In addition, compared to traditional TSOP packaging methods, BGA packaging has a faster and more effective heat dissipation path.

　　The I/O terminals of BGA packaging are distributed in an array of circular or columnar solder joints below the packaging. The advantage of BGA technology is that although the number of I/O pins increases, the pin spacing does not decrease but increases, thereby improving the assembly yield; Although its power consumption increases, BGA can be soldered using a controllable collapse chip method, which can improve its electrothermal performance; The thickness and weight have been reduced compared to previous packaging technologies; The parasitic parameters (which cause output voltage disturbance when the current changes significantly) are reduced, the signal transmission delay is small, and the usage frequency is greatly increased; Assembly can be done by coplanar welding, with high reliability.