FPC: Flexible Printed Circuit, abbreviated as Flexible Board, in English. It is a single-sided, double-sided, and multi-layer circuit board made by using an etching process on a flexible substrate surface. The surface circuit can also be electrically connected to the inner and outer layers through metallized holes.

　　The production method of flexible circuit boards is simple and cost-effective, while compared to traditional (hard boards), they achieve weight breakthroughs and are thinner. Flexible circuit boards in certain fields can also effectively reduce device volume and facilitate portability. It has a wide range of application scenarios, high experimental value, and long-lasting research and preparation enthusiasm.

　　So far, the vast majority of FPC board circuit fabrication has been done using addition and subtraction (etching) processing, usually by photolithography on copper foil to prepare traditional FPC boards. Firstly, the printing/lithography circuit needs to be printed, followed by development, film removal, silk screen resistance welding, followed by surface treatment, and finally punching. The process is complex and not easy to succeed at once, and there are also many equipment and instruments required prepare high-performance FPC circuits. Its advantages are higher efficiency compared to traditional methods, which can be prepared through a printer and a matching heating table. Not only can it shorten the time required for preparing devices, but it can also design other planar structures based on this.