Aluminum substrate is a unique metal based copper clad plate with good thermal conductivity, electrical insulation performance, and mechanical processing performance. Let the aluminum substrate manufacturer provide you with a detailed explanation of the aluminum substrate.

　　1、 Characteristics of aluminum substrate

　　1. Adopting Surface Mount Technology (SMT);

　　2. Effectively handle thermal diffusion in circuit design schemes;

　　3. Reduce product operating temperature, improve product power density and reliability, and extend product service life;

　　4. Reduce product volume, reduce hardware and assembly costs;

　　5. Replace fragile ceramic substrates for better mechanical durability.

　　2、 Structure of aluminum substrate

　　Aluminum based copper clad plate is a metal circuit board material composed of copper foil, thermal insulation layer, and metal substrate:

　　Copper foil: equivalent to a copper clad board of a regular PCB, with a copper foil thickness of loz to 10oz for the circuit.

　　Thermal insulation layer: The insulation layer is a low thermal resistance thermal insulation material.

　　Metal substrate: generally aluminum based copper clad plate and traditional epoxy glass cloth laminated plate.

　　Explanation:

　　1. The circuit layer (i.e. copper foil) is etched to form a printed circuit, connecting the various components of the component to each other. Generally, it is required to have a large current carrying capacity, so thicker copper foil is used, with a thickness of generally 35 μ M~280 μ M;

　　2. The thermal insulation layer is the core of the aluminum substrate, which is generally composed of special polymers filled with special ceramics, with low thermal resistance, excellent viscoelastic performance, and the ability to resist thermal aging, and can withstand mechanical and thermal stress.

　　3. The metal substrate is a supporting component of the aluminum substrate, which has high thermal conductivity. It is generally aluminum plate, and copper plate can also be used, suitable for conventional mechanical processing such as drilling, punching, and cutting.

　　3、 The purpose of aluminum substrate:

　　1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.

　　2. Power supply equipment: switch regulator, DC/AC converter, SW regulator, etc.

　　3. Communication electronic equipment: high-frequency amplifier, filtering device, and transmitting circuit.

　　4. Office automation equipment: motor drivers, etc.

　　5. Automotive: electronic regulators, igniters, power controllers, etc.

　　6. Computer: CPU board, floppy drive, power device, etc.

　　7. Power module: inverter, solid-state relay, rectifier bridge, etc.