Capabilities&Applications

Capabilities

PCB Process Capability PCBA Process Capability PCB Equipment PCBA Equipment

SMT process

Item			Standard Capability	Limited Capability	Remark
SMT process	PCB	Min Size	L≥30mm,W≥30mm	L<30mm,W<30mm	BOT、TOP sides components、Fiducial Mark should be≥3mm from the board edge.
		Max Size	L≤650mm,W≤400mm	L:800-650mm,W:400-450mm
		Component thickness(T)	0.5mm≤T≤3mm	T＜0.5mm T＞3mm
	Component size	Min Package	0201 (0.6mm*0.3mm)	01005 (0.3mm*0.2mm)
	QFP、QFN、SOP、SOJ	Min Pin distance	0.4mm	0.3mm≤Pitch<0.4mm
	CSP、BGA	Min Pitch distance	0.4mm	0.3mm≤Pitch<0.4mm

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DIP Process (Wave soldering)

Item			Standard Capability	Limited Capability
DIP Process (Wave soldering)	PCB size	Min Size	L≥30mm,W≥30mm	L＜30mm
		Max Size	L≤650mm,W≤400mm	L:800-650mm,W:400-450mm
		Thinnest size	0.4mm	T＜0.4mm
		Thickest size	5mm	T>5mm

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Conformal Coating Process

Item	Standard Capability	Limited Capability	Remark
Conformal Coating Process	Technological parameter	Temperature range	-30°C≤T≤120°C	-50°C≤T≤150°C
Coating thickness	20um≤T≤35um	35um≤T≤60um

Item

Standard Capability

Limited Capability

Remark

Conformal Coating

Process

Technological

parameter

Temperature range

-30°C≤T≤120°C

-50°C≤T≤150°C

Coating thickness

20um≤T≤35um

35um≤T≤60um

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lndustrial Control: Leading technology
1.Max.layers:38L, the min.track w/d is 3mil/3mil, the plating hole aspect ratio is 13:1, and the drill hole is 0.10mm(laser hole is 0.075mm).
2.High precision lamination positioning and hot melt and shooting technology, to ensure the quality of multilayers PCB processing.
3.Various types of rigid flexible lamination design, to meet different industrial products
4.High precision back drilling and depth control technology,to meet the integrity design of product signal transmission

Advanced research and development strength
1.More than 10 professional and technical teams with more than 20 years of PCB experience, provide clients products and services of high stability.

Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

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Electrical Energy: Leading technology
1.The copper thickness can be more than 12OZ,to meet the requirements of high current design.
2.Strictly implement quality PDCA process and continuously improve product performance
3.Meet the requirements of multiple blind hole design of power supply products, the matching design of pressure expansion and shrinkage, vacuum resin plugging technology, etc.
4.Local embedded copper block technology to meet the design requirements of high heat dissipation.

Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

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Medical Equipment: Leading technology
1.Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
2.FR4+ high frequency mixed pressure, high frequency multistage step plate, metal base, etc
3.Mechanical blind burring, HDI, rigid torsion combination and other processing technology.

Advanced research and development strength
1.10 years' experience in R&D and manufacturing of medical printed circuit boards, including medical diagnosis, patient intelligent drug injection, patient intelligent monitoring system, X-ray machine, B-ultrasound machine, blood glucose meter, etc.
2.Assist customers to develop new products such as endoscope, scalpel and lifting beds.
3.Production of multiple high level HDI and rigid flexible joint and other processing technologies.

Advanced production equipment&Complete quality control system
1.100% of products have been tested by imported AOI to reduce electrical leakage and ensure that the inductance of power products meets customer design requirements.
2.More than 20 kinds of reliability testing equipment, such as reflow welding, thermal shock, pore copper tester, impedance tester, gold-nickel thickness tester, etc.
3.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
4.Strictly implement quality PDCA process and continuously improve product performance.
5.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

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Communication Equipment: Leading technology
1.Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
2.Mature hybrid laminating technology meets the pressing requirements of FR4+rogers3 series, 4 series, 5 series /Arlon/ PTFE and other materials to ensure the leading characteristics of products.
3.Years of experience in wireless communication, network communication and other products processing, to meet the requirements of different product types of customers.

Advanced research and development strength
1.More than 15 years of experience in the development and manufacturing of communication equipment circuit boards.
2.Assist customers to develop radio frequency transmission and receivers, mobile base stations, etc.
3.Production of multi-high level HDI and rigid flexible combination and other processing technology, used in communication equipment, mobile phones, Bluetooth modules, etc.

Top raw material suppliers
1.Long-term strategic cooperation with top material suppliers Rogers, Taconic, Arlon, Kingboard, Biggs, Sunyi, Taiyao, Panasonic and DuPont.
2.Electroplating special use Rohm and Haas electroplating potion, Fuji film, Hitachi dry film, sun ink.

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Automotive Electronics: Leading technology
1.The top number is 38 layers, the minimum line width and line distance is 3mil/3mil, the plating hole aspect ratio is 13:1, and the drill hole is 0.1mm(laser hole is 0.075mm).
2.High precision pressing positioning and hot melt and shooting technology, to ensure the processing quality of high multilayer PCB.
3.Various types of rigid flexible binding plate process structure, to meet the needs of different vehicle type products.
4.Metal base, aluminum base plate, thick copper processing technology, to ensure high heat dissipation requirements of products.

Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
4.Ensure that the hole copper and surface copper meet customer requirements, electroplating special use Rohm and Haas electroplating potions, Fuji film, Hitachi dry film, sun ink, etc.

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Capability

Item	Project name	Process capability
Capability	Layers	1-36L
	Board thickness	0.1-8.0mm
	High Frequency	PTFE，Ceramic、Rogers
	HDI	HDI
	HDI Stage	1-5 Stage（≥6 Stage need to appraisal）
	Min PCS size	pcs size 5*5mm（less than 3mm need to appraisal）
	Max Panel size	21*33inch
	Max Finish copper thickness	12OZ
	Min Finish copper thickness	1/2oz
	Layer to layer accuracy	≤3mil
	Board thickness of Resin	0.2-6.0mm
	Board thickness tolerance	Thickness≤1.0mm；±0.1mm Thickness＞1.0mm；±10%
	Impedance tolerance	±5Ω（＜50Ω），±10%（≥50Ω）；Min±8%（≥50Ω）
	Bow and twist	Normal:0.75%，Min:0.5% Max:2.0%
	Lamination times	one core ≤5 times

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Material Type

Item	Project name	Process capability
Material Type	Normal TG FR4	SY S1141、KB 6160A
	Middle TG FR4	SY S1150G、KB6165 F、KB6165G(HF)
	High TG FR4	SY S1000-2、SY S1165(HF)、KB 6167G(HF)、KB 6167F、TU-768、TU-872、VT-47；
	Aluminum	GL12、SPS-AL-01、CH-AL-LM3
	CTI 600	SY S1600
	High Frequency	Rogers4350、Rogers4003;Arlon 25FR、25N;
	PTFE	Rogers series、Taconic series、Arlon series、F4Bseries 、TP series
	Minture+FR4	Rogers、Taconic、Arlon、Nelco、F4B+FR-4

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Metal material

Item	Project name	Process capability
Metal material	Layers	Alumi、Metal:1-8L；Ceramic board:1-2L；
	PCS Size	MAX:610610mm、MIN:55mm
	Max Panel size(Ceramic board)	100*100mm
	Finish board thickness	0.5-5.0mm
	Copper thickness	0.5-12 OZ
	Matel thickness	0.5-4.5mm
	Matel material type	AL:1100/1060/2124/3003/5052/6061;Copper:Purple copper
	Min finish holes and tolerance	NPTH:0.5±0.05mm；PTH(Aluminum;Metal)：0.3±0.1mm；
	CNC tolerance	±0.2mm
	PCB Surface Treatment	HASL/HASL L/F;OSP；ENEPIG；Hard gold;Heavy gold
	Metal PCB Surface Treatment	ENEPIG
	Matel material	Bergquist（MP06503、HT04503）；TACONIC（TLY-5、TLY-5F）；
	Dielectric thickness	75-200um
	Thermal conductivity	0.3-3W/m.k（Aluminum,Metal）；24-180W/m.k（Ceramic）

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Product Type

Item	Project name	Process capability
Product Type	Rigid boarad	Back board、HDI、Multilayer burried board、Heavy copper、Power heavy copper、IC Substrate

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Stack up

Item	Project name	Process capability
Stack up	HDI board	1+N+1、1+1+N+1+1、2+N+2、3+N+3(Burried hole size 0.3mm) Filled vias with copper capped

Item

Project name

Process capability

Stack up

HDI board

1+N+1、1+1+N+1+1、2+N+2、3+N+3(Burried hole size 0.3mm)

Filled vias with copper capped

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Surface Treatment

Item	Project name	Process capability
Surface Treatment	PB Free	Gold Plating 、ENIG、Gold finger、HASL L/F、OSP、ENEPIG、immersion silver、immersion Tin、ENIG+OSP、ENIG+G/F、Gold Plating +G/F、immersion silver+G/F、immersion Tin+G/F
	PB	HASL
	A/R Ratio	10：1（HASL、HASL L/F、ENEPIG、immersion silver、immersion Tin）；8：1（OSP）
	Board thickness	ENIG：0.2-7.0mm，immersion Tin：0.3-7.0mm（Vertical）、0.3-3.0mm（Level）；immersion silver：0.3-3.0mm；HASL、HASL L/F：0.6-3.5mm、OSP：0.3-3.0mm；Gold plating：0.3-5.0mm（A/R:10:1）
	IC SPACE	3mil

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Surface Treatment Thickness

Item	Project name	Process capability
Surface Treatment Thickness	HASL、HASL L/F	2-40um（HASL MAX:0.4um、HASL L/F MAX:1.5um）
	OSP	0.2-0.4um
	ENIG	Ni：3-5um；Au：1-5uinch，≥3uinch(Need to appraisal)
	Immersion silver	6-12uinch
	Immersion Tin	≥1um
	Gold Hard Plating	2-50uinch
	ENEPIG	Ni:3-5um，Pd：1-6uinch，Au：1-5uinch
	Gold Plating	Au:0.025-0.10um，Ni≥3um，
	Gold Plating +G/F	Au:1-50uinch、Ni≥3um
	Carbon ink	10-50μm
	Liquid	copper(10-18um)、via hole（5-8um）、line corner≥5u
	Peelable	0.20-0.80mm

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lntelligent Security: Leading technology
1.Multi-layer thick copper plate UL certification, minimum line width and line distance of 3mil/3mil, maximum hole drilling 0.1mm(laser hole 0.075mm)
2.BGA adopts three-machine plug hole and aluminum sheet plug hole to ensure that there is no copper short circuit problem.
3.Strictly implement quality PDCA process and continuously improve product performance

Advanced research and development strength
1.Super multi-layer processing technology, can achieve 2-38 layers of plate production, meet the requirements of product design.
2.Years of experience in wireless communication, network communication, electronic monitoring and other products processing, to meet the requirements of different product types of customers.

Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

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Consumer Electronics: Leading technology
1.Long-term strategic cooperation with industry top material suppliers Kingboard, Shengyi, Taiyao, Panasonic and DuPont.
2.FR1,22F, CIM-1, CIM-3,FR4,FR4 TG150,FR4 TG170,FR4 TG180 and other materials.
3.Use the Low DK,Low DF, high CTI, and CAF materials.

Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

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Aerospace: Leading technology
Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
Mature hybrid laminating technology meets the pressing requirements of FR4+rogers3 series, 4 series, 5 series /Arlon/ PTFE and other materials to ensure the leading characteristics of products.
Years of experience in GPS, infrared sensor and other products processing, to meet the requirements of different product types of customers.

Advanced research and development strength
More than 15 years of experience in the development and manufacturing of GPS communication equipment circuit boards.
Assist customers to develop radio frequency transmission and receivers, mobile base stations,GPS positioning and satellite positioning devices, etc.
Production of multi-high level HDI and rigid flexible combination and other processing technology, used in communication equipment, mobile phones, Bluetooth modules, etc.

Top raw material suppliers
Long-term strategic cooperation with top material suppliers Rogers, Taconic, Arlon, Kingboard, Biggs, Sunyi, Taiyao, Panasonic and DuPont.
Electroplating special use Rohm and Haas electroplating potion, Fuji film, Hitachi dry film, sun ink.

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Drilling

Item	Project name	Process capability
Drilling	0.15/0.2mm Mechanical drilling board thickness(Max)	1.5mm/2.5mm
	Laser drilling size(Min)	0.1mm
	Laser drilling size(Max)	0.15mm
	Drilling size	0.15-6.2mm PTFE series :0.25mm(drill bit:0.35mm） Mechanical Blind and Burried holes size≤0.3mm Close hole size:0.35mm(Min)（drill bit:0.45mm） PTH Half hole size:0.40mm（drill bit:0.5mm）
	A/R Ratio	20:1(≤0.2mm)
	Back drill depth	0.2mm
	Drilling to conductor space	5.5mil(≤8L)；6.5mil（10-14L）；7mil(＞14L)
	Mechanical drilling to conductor space(2stage HDI)	7mil（one time）；8mil(two time)；9mil(three time)
	Laser drilling to conductor space	7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）
	PTH edge to PTH edge space(diff net)	10mil
	PTH edge to PTH edge space(same net)	6mil(drilling;laser drilling)；10mil（Mechanical HDI）
	NPTH edge to NPTH edge space	8mil
	Drilling accuracy	±2mil
	NPTH tolerance	±2mil
	PTH tolerance	±2mil
	countersunk	±0.15mm

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Outer layer PAD

Item	Project name	Process capability
Outer layer PAD	Inner Layer and outer Layer PAD size(Laser drilling)	10mil（4mil Laser drilling size），11mil（5mil Laser drilling size）
	Inner Layer and outer Layer PAD size(Mechanical drilling)	16mil（8mil drilling size）
	BGA PAD Size(min)	HASL:10mil，Other:7mil
	BGA tolerance	+/-1.2mil（PAD＜12mil）；+/-10%（PAD≥12mil）

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Line width/space

Item	Project name	Process capability
Line width/space	width/space	1/2OZ：3/3mil 1OZ: 3/3.5mil 2OZ: 5/5mil 3OZ: 7/7mil 4OZ: 10/10mil 5OZ: 15/15mil 6OZ: 18/18mil 7OZ: 20/20mil 8OZ: 24/24mil 9OZ: 26/26mil 10OZ: 28/28mil 12OZ: 32/32mil
Line tolerance	≤10mil：+/-1.0mil ＞10mil：+/-1.5mil

Item

Project name

Process capability

Line width/space

width/space

1/2OZ：3/3mil

1OZ: 3/3.5mil

2OZ: 5/5mil

3OZ: 7/7mil

4OZ: 10/10mil

5OZ: 15/15mil

6OZ: 18/18mil

7OZ: 20/20mil

8OZ: 24/24mil

9OZ: 26/26mil

10OZ: 28/28mil

12OZ: 32/32mil

Line tolerance

≤10mil：+/-1.0mil

＞10mil：+/-1.5mil

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Solder mask and Silk screen

Item	Project name	Process capability
Solder mask and Silk screen	Solder mask plugged hole size(Min)	0.5mm
	Solder mask color	Green、Yellow、Black、Blue、Red、White、Purple、Pink、Matt Green、Matte Black、cold white.
	Silk screen color	White、Yellow、Black
	Peelable hole size(Max)	10.0mm
	Resin hole size	0.1-1.0mm
	Solder mask dam	Green:3.5mil、Other:6mil
	Silk screen line width(Min)	Width:3mil,High:24mil(White)； Width:5mil,High:32mil(Black)；
	Hollow out on silk screen space(Min)	Width:8mil,High:40mil
	Hollow out on solder mask space(Min)	Width:8mil,High:40mil

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Router

Item	Project name	Process capability
Router	V-CUT to conductor space	H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°); 1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); 1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
	V-CUT symmetrical tolerance	±4mil
	V-CUT Angle tolerance	±5°
	V-CUT Spec	20°、30°、45°
	G/F bevel	20°、30°、45°
	G/F bevel angle tolerance	±5°
	Controlled milling/drill tolerance(NPTH)	±0.10mm
	Outline tolerance	±4mil
	Router slot hole tolerance（PTH）	Slot hole width and length ±0.15mm
	Router slot hole tolerance（NPTH）	Slot hole width and length ±0.10mm
	Drilling slot hole tolerance（PTH）	±4mil
	Drilling slot hole tolerance（NPTH）	±2mil

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