Leading technology

1.Multi-layer thick copper plate UL certification, minimum line width and line distance of 3mil/3mil, maximum hole drilling 0.1mm(laser hole 0.075mm)

2.BGA adopts three-machine plug hole and aluminum sheet plug hole to ensure that there is no copper short circuit problem.

3.Strictly implement quality PDCA process and continuously improve product performance

Advanced research and development strength

1.Super multi-layer processing technology, can achieve 2-38 layers of plate production, meet the requirements of product design.

2.Years of experience in wireless communication, network communication, electronic monitoring and other products processing, to meet the requirements of different product types of customers.

Advanced production equipment&Complete quality control system

1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc

2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements

3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.